Invention Grant
- Patent Title: Electrostatic chuck and semiconductor manufacturing apparatus
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Application No.: US17469260Application Date: 2021-09-08
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Publication No.: US11776836B2Publication Date: 2023-10-03
- Inventor: Akihito Ono , Jumpei Uefuji
- Applicant: TOTO LTD.
- Applicant Address: JP Kitakyushu
- Assignee: Toto Ltd.
- Current Assignee: Toto Ltd.
- Current Assignee Address: JP Fukuoka
- Agency: Carrier, Shende & Associates P.C.
- Agent Joseph P. Carrier; Fulchand P. Shende
- Priority: JP 20162185 2020.09.28 JP 21050162 2021.03.24 JP 21107306 2021.06.29
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01T23/00 ; H01J37/32 ; H05B3/28

Abstract:
An electrostatic chuck includes a ceramic dielectric substrate; a base plate; and a heater unit which heats the ceramic dielectric substrate. The heater unit includes a first heater element. The first heater element has a plurality of sub-zones. The sub-zones include a first sub-zone. The first sub-zone includes a sub-heater line generating heat by allowing a current to flow, a first sub-power feeding portion feeding a power to the sub-heater line, and a second sub-power feeding portion feeding a power to the sub-heater line. The first sub-zone has a central region located centrally in the first sub-zone and an outer peripheral region located outside the central region when viewed along a Z-direction perpendicular to the first major surface. At least one of the first sub-power feeding portion and the second sub-power feeding portion is provided in the central region.
Public/Granted literature
- US20220102183A1 ELECTROSTATIC CHUCK AND SEMICONDUCTOR MANUFACTURING APPARATUS Public/Granted day:2022-03-31
Information query
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