- 专利标题: Joining material and silicon carbide based honeycomb structure
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申请号: US16803092申请日: 2020-02-27
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公开(公告)号: US11767270B2公开(公告)日: 2023-09-26
- 发明人: Keisuke Kimura
- 申请人: NGK INSULATORS, LTD.
- 申请人地址: JP Nagoya
- 专利权人: NGK INSULATORS, LTD.
- 当前专利权人: NGK INSULATORS, LTD.
- 当前专利权人地址: JP Nagoya
- 代理机构: BURR PATENT LAW, PLLC
- 优先权: JP 19061681 2019.03.27
- 主分类号: B01D46/24
- IPC分类号: B01D46/24 ; C04B38/00 ; C04B35/565 ; B01D39/20 ; C04B26/28
摘要:
A joining material used for joining side surfaces of a plurality of silicon carbide-based honeycomb segments to each other to produce a silicon carbide-based honeycomb structure. The joining material contains from 0.1 to 50% by mass of processed powder generated in the production of the silicon carbide-based honeycomb segments and/or the silicon carbide-based honeycomb structure. The joining material has an average particle diameter D50 of from 0.5 to 60 μm.
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