Invention Grant
- Patent Title: Systems and methods for support material removal
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Application No.: US16402977Application Date: 2019-05-03
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Publication No.: US11738519B2Publication Date: 2023-08-29
- Inventor: Lawrence A Binek , David W Morganson
- Applicant: UNITED TECHNOLOGIES CORPORATION
- Applicant Address: US CT Farmington
- Assignee: Raytheon Technologies Corporation
- Current Assignee: Raytheon Technologies Corporation
- Current Assignee Address: US CT Farmington
- Agency: Snell & Wilmer L.L.P.
- Main IPC: B29C64/40
- IPC: B29C64/40 ; B29C64/393 ; B33Y40/20 ; B22F10/28 ; B33Y10/00 ; B33Y40/00 ; B33Y50/02 ; B22F10/43 ; B22F10/80 ; B22F10/66 ; B22F10/12 ; B22F10/14 ; B22F10/25

Abstract:
A method of manufacturing an additively manufactured component may comprise operating an additive manufacturing machine to form a first structure including an elongate portion having a blind design surface, operating the additive manufacturing machine to form a removal tool proximate the blind design surface, wherein the blind design surface and the removal tool are at least partially enclosed by and in contact with a support material, and translating the removal tool along the blind design surface to separate a portion of the support material from the blind design surface.
Public/Granted literature
- US20200346413A1 SYSTEMS AND METHODS FOR SUPPORT MATERIAL REMOVAL Public/Granted day:2020-11-05
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