Invention Grant
- Patent Title: Generation of layout including power delivery network
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Application No.: US17703898Application Date: 2022-03-24
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Publication No.: US11681854B2Publication Date: 2023-06-20
- Inventor: Chung-Chieh Yang , Tai-Yi Chen , Yun-Ru Chen , Yung-Chow Peng
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Maschoff Brennan
- Main IPC: G06F30/398
- IPC: G06F30/398 ; G06F30/392 ; G06F30/367 ; G06F30/3953 ; G06F30/373 ; G06F119/06

Abstract:
A method is disclosed including: generating, based on design information for an integrated circuit, a circuit design that includes an initial power delivery network (PDN) for the integrated circuit; performing a pre-layout simulation to the circuit design that includes the initial power delivery network, to determine whether the circuit design meets a predetermined specification; generating a circuit layout of the integrated circuit when the circuit design meets the predetermined specification; and adding at least one additional conductive pillar or at least one additional power rail in the initial power delivery network according to a relationship of a pillar density of the initial power delivery network and a maximum pillar density when the circuit design does not meet the predetermined specification.
Public/Granted literature
- US20220215152A1 GENERATION OF LAYOUT INCLUDING POWER DELIVERY NETWORK Public/Granted day:2022-07-07
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