- 专利标题： Method of manufacturing light source device having a bonding layer with bumps and a bonding member
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申请号： US16724995申请日： 2019-12-23
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公开(公告)号： US11677062B2公开(公告)日： 2023-06-13
- 发明人: Takashi Matsumoto , Naoki Harada , Fukutaro Saegusa , Yoshiyuki Kageyama
- 申请人： NICHIA CORPORATION
- 申请人地址： JP Anan
- 专利权人： NICHIA CORPORATION
- 当前专利权人： NICHIA CORPORATION
- 当前专利权人地址： JP Anan
- 代理机构： Birch, Stewart, Kolasch & Birch, LLP
- 优先权： JP 2018240933 2018.12.25 JP 2019110484 2019.06.13
- 主分类号： H01L33/64
- IPC分类号： H01L33/64 ; H01L33/00 ; H01L23/00 ; H01L33/62
摘要：
A method of manufacturing a light source device includes: disposing bumps containing a first metal on a first substrate which is thermally conductive; disposing a bonding member on the bumps, the bonding member containing Au—Sn alloy; disposing a light emitting element on the bumps and the bonding member; and heating the first substrate equipped with the bumps, the bonding member, and the light emitting element.
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