- 专利标题： Electronic package with multiple electronic components spaced apart by grooves
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申请号： US17747900申请日： 2022-05-18
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公开(公告)号： US11676877B2公开(公告)日： 2023-06-13
- 发明人: Hong-Da Chang , Chun-Chang Ting , Chi-Jen Chen
- 申请人： Siliconware Precision Industries Co., Ltd.
- 申请人地址： TW Taichung
- 专利权人： Siliconware Precision Industries Co., Ltd.
- 当前专利权人： Siliconware Precision Industries Co., Ltd.
- 当前专利权人地址： TW Taichung
- 代理机构： Kelly & Kelley, LLP
- 优先权： TW 8132528 2019.09.10
- 分案原申请号： US16734612 2020.01.06
- 主分类号： H01L23/31
- IPC分类号： H01L23/31 ; H01L21/56
摘要：
A method for fabricating an electronic package is provided. A filling material is formed in an interval S, at which a plurality of electronic components disposed on a carrying structure are spaced apart from one another. The filling material acts as a spacer having a groove, and the groove acts as a stress buffering region. Therefore, the electronic components can be prevented from being broken due to stress concentration.
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