Invention Grant
- Patent Title: Hyperbaric saw for sawing packaged devices
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Application No.: US17139072Application Date: 2020-12-31
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Publication No.: US11676829B2Publication Date: 2023-06-13
- Inventor: Byron Harry Gibbs , Michael Todd Wyant
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Dawn Jos; Frank D. Cimino
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/78 ; H01L21/48 ; H01L21/56 ; H01L23/00
Abstract:
In a described example, an apparatus includes: a process chamber configured for a pressure greater than one atmosphere, having a device chuck configured to support electronic devices that are mounted on package substrates and partially covered in mold compound, the electronic devices spaced from one another by saw streets; and a saw in the process chamber configured to cut through the mold compound and package substrates in the saw streets to separate the molded electronic devices one from another.
Public/Granted literature
- US20220208571A1 HYPERBARIC SAW FOR SAWING PACKAGED DEVICES Public/Granted day:2022-06-30
Information query
IPC分类:
