- 专利标题: Resist and etch modeling
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申请号: US17045168申请日: 2019-04-08
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公开(公告)号: US11624981B2公开(公告)日: 2023-04-11
- 发明人: Saravanapriyan Sriraman , David M. Fried
- 申请人: Lam Research Corporation
- 申请人地址: US CA Fremont
- 专利权人: Lam Research Corporation
- 当前专利权人: Lam Research Corporation
- 当前专利权人地址: US CA Fremont
- 代理机构: Weaver Austin Villeneuve & Sampson LLP
- 国际申请: PCT/US2019/026396 WO 20190408
- 国际公布: WO2019/199697 WO 20191017
- 主分类号: G03F1/70
- IPC分类号: G03F1/70 ; G03F1/80 ; G03F7/20 ; H01L21/66
摘要:
Computer implemented methods and computer program products have instructions for generating transfer functions that relate segments on lithography photomasks to features produced by photolithography and etching using such segments. Such methods may be characterized by the following elements: (a) receiving after development inspection metrology results produced from one or more first test substrates on which resist was applied and patterned using a set of design layout segments; (b) receiving after etch inspection metrology results produced from one or more second test substrates which were etched after resist was applied and patterned using said set of design layout segments; and (c) generating the transfer function using the set of design layout segments together with corresponding after development inspection metrology results and corresponding after etch inspection metrology results.
公开/授权文献
- US20210157228A1 RESIST AND ETCH MODELING 公开/授权日:2021-05-27
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