- 专利标题： Additive for electrolytic plating solutions, electrolytic plating solution containing additive for electrolytic plating solutions, and electrolytic plating method using electrolytic plating solution
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申请号： US16641869申请日： 2018-08-23
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公开(公告)号： US11624120B2公开(公告)日： 2023-04-11
- 发明人: Shinichi Tanaka , Shouhei Toyoda , Shinya Ishiwata , Takuya Takahashi , Yong Gyun Kim
- 申请人： ADEKA CORPORATION
- 申请人地址： JP Tokyo
- 专利权人： ADEKA CORPORATION
- 当前专利权人： ADEKA CORPORATION
- 当前专利权人地址： JP Tokyo
- 代理机构： Wenderoth, Lind & Ponack, L.L.P.
- 优先权： JPJP2017-166424 20170831
- 国际申请： PCT/JP2018/031139 WO 20180823
- 国际公布： WO2019/044651 WO 20190307
- 主分类号： C25D3/38
- IPC分类号： C25D3/38 ; C07C237/10 ; C08G83/00
摘要：
The present invention provides an additive for electrolytic plating solutions, containing at least one selected from compounds represented by the chemical formulas (1) to (4) given in the present description, an electrolytic plating solution containing the additive for electrolytic plating solutions, and an electrolytic plating method that uses the electrolytic plating solution.
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