A wiring structure and a method for manufacturing the same are provided. The wiring structure includes a substrate structure, a redistribution structure, an adhesive layer and at least one conductive pillar. The redistribution structure includes at least one dielectric layer. The at least one dielectric layer defines at least one through hole extending through the dielectric layer. The adhesive layer is disposed between the redistribution structure and the substrate structure and bonds the redistribution structure and the substrate structure together. The at least one conductive pillar extends through the redistribution structure and the adhesive layer and is electrically connected to the substrate structure. A portion of the at least one conductive pillar is disposed in the through hole of the at least one dielectric layer.