Invention Grant
- Patent Title: Semiconductor structure
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Application No.: US17397765Application Date: 2021-08-09
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Publication No.: US11616035B2Publication Date: 2023-03-28
- Inventor: Teng-Chuan Hu , Chun-Hung Chen , Chu-Fu Lin
- Applicant: United Microelectronics Corp.
- Applicant Address: TW Hsinchu
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TW Hsinchu
- Agency: J.C. Patents
- Priority: TW110126751 20210721
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L23/00 ; H01L25/18
Abstract:
A semiconductor structure, including a substrate and multiple chips, is provided. The chips are stacked on the substrate. Each of the chips has a first side and a second side opposite to each other. Each of the chips includes a transistor adjacent to the first side and a storage node adjacent to the second side. Two adjacent chips are bonded to each other. The transistor of one of the two adjacent chips is electrically connected to the storage node of the other one of the two adjacent chips to form a memory cell.
Public/Granted literature
- US20230025541A1 SEMICONDUCTOR STRUCTURE Public/Granted day:2023-01-26
Information query
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