- 专利标题: Three-dimensional shaping device and injection molding device
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申请号: US17005975申请日: 2020-08-28
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公开(公告)号: US11602880B2公开(公告)日: 2023-03-14
- 发明人: Kenta Anegawa
- 申请人: SEIKO EPSON CORPORATION
- 申请人地址: JP Tokyo
- 专利权人: SEIKO EPSON CORPORATION
- 当前专利权人: SEIKO EPSON CORPORATION
- 当前专利权人地址: JP Tokyo
- 代理机构: Workman Nydegger
- 优先权: JPJP2019-157928 20190830
- 主分类号: B29C45/18
- IPC分类号: B29C45/18 ; B29C45/20 ; B29C45/76 ; B29C45/72 ; B29C45/00
摘要:
A three-dimensional shaping device includes: a material storage unit and a mouth portion which is provided below the body portion and which has a hole with a diameter smaller than a maximum inner diameter of the body portion, a material supply unit configured to supply a material to the material storage unit, a melting unit configured to melt the material supplied through the mouth portion, a nozzle configured to discharge the shaping material toward a stage, a remaining state detection unit configured to detect a remaining state of the material, a remaining amount determination unit configured to determine whether a remaining amount of the material is less than a first reference value based on the remaining state, and a control unit configured to supply, when the remaining amount is less than the first reference value, the material to the material storage unit.
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