Invention Grant
- Patent Title: Elastic wave device, high-frequency front end circuit, and communication apparatus
-
Application No.: US16429098Application Date: 2019-06-03
-
Publication No.: US11595024B2Publication Date: 2023-02-28
- Inventor: Hideaki Takahashi , Hirokazu Sakaguchi , Yasuharu Nakai
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Nagaokakyo
- Agency: Keating & Bennett, LLP
- Priority: JPJP2016-235936 20161205
- Main IPC: H03H9/145
- IPC: H03H9/145 ; H03H9/02 ; H03H9/25 ; H03H9/64 ; H03H9/72

Abstract:
An elastic wave device includes a piezoelectric substrate, an IDT electrode on the piezoelectric substrate, and a silicon oxide film arranged on the piezoelectric substrate to cover the IDT electrode. The IDT electrode includes first and second electrode layers laminated on each other, the first electrode layer is made of metal or an alloy with a density higher than a density of metal of the second electrode layer and a density of silicon oxide of the silicon oxide film, the piezoelectric substrate is made of LiNbO3 and θ is in a range of equal to or greater than about 8° and equal to or less than about 32° with Euler Angles (0°±5°, θ, 0°±10°) of the piezoelectric substrate, and the silicon oxide film contains hydrogen atoms, hydroxyl groups, or silanol groups.
Public/Granted literature
- US20190288668A1 ELASTIC WAVE DEVICE, HIGH-FREQUENCY FRONT END CIRCUIT, AND COMMUNICATION APPARATUS Public/Granted day:2019-09-19
Information query
IPC分类: