- 专利标题： Transferrable pillar structure for fanout package or interconnect bridge
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申请号： US17115882申请日： 2020-12-09
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公开(公告)号： US11587896B2公开(公告)日： 2023-02-21
- 发明人: Joshua M. Rubin , Yang Liu , Steven Lorenz Wright , Paul S. Andry
- 申请人： International Business Machines Corporation
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理商 Jeffrey M. Ingalls
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L23/538
摘要：
A pillar structure is provided. The pillar structure includes a plurality of pillars. Each of the pillars include a capping material layer formed in a pit etched into a template wafer, a conductive plug formed on the capping material layer, a base layer formed on the conductive plug, and an attach material layer formed on the base layer. The pillars are joined vertically together to form the pillar structure.
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