- 专利标题: Dual-circuit heating, ventilation, air conditioning, and refrigeration systems and associated methods
-
申请号: US16923667申请日: 2020-07-08
-
公开(公告)号: US11585575B2公开(公告)日: 2023-02-21
- 发明人: Yang Zou , Sivakumar Gopalnarayanan
- 申请人: Rheem Manufacturing Company
- 申请人地址: US GA Atlanta
- 专利权人: Rheem Manufacturing Company
- 当前专利权人: Rheem Manufacturing Company
- 当前专利权人地址: US GA Atlanta
- 代理机构: Eversheds Sutherland (US) LLP
- 主分类号: F25B9/10
- IPC分类号: F25B9/10 ; F25B39/00 ; F25B9/00
摘要:
Systems and methods for improved heating, ventilation, air conditioning, and refrigeration systems incorporating a plurality of refrigerant circuits. The system can include a compressor having a first compression chamber, a second compression chamber, and a motor. The system can further include a heat exchanger having a first set of microchannel coils and a second set of microchannel coils. The system can have a first circuit fluidly coupled between the first compression chamber and the first set of microchannel coils and a second circuit fluidly coupled between the second compression chamber and the second set of microchannel coils. Further, the first circuit comprises a first refrigerant and the second circuit comprises a second refrigerant.
公开/授权文献
信息查询