- 专利标题: Pixel array substrate
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申请号: US17008607申请日: 2020-08-31
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公开(公告)号: US11552230B2公开(公告)日: 2023-01-10
- 发明人: Shang-Jie Wu , Hao-An Chuang , Yu-Chieh Kuo , He-Yi Cheng , Che-Chia Chang , Yi-Jung Chen , Yi-Fan Chen , Yu-Hsun Chiu , Mei-Yi Li , Yu-Chin Wu
- 申请人: Au Optronics Corporation
- 申请人地址: TW Hsinchu
- 专利权人: Au Optronics Corporation
- 当前专利权人: Au Optronics Corporation
- 当前专利权人地址: TW Hsinchu
- 代理机构: JCIPRNET
- 优先权: TW109116012 20200514
- 主分类号: H01L33/62
- IPC分类号: H01L33/62 ; G09G3/00 ; G09G3/32
摘要:
A pixel array substrate includes a base, pixel structures, first bonding pads, first wirings, and a first testing element. The pixel structures are disposed on an active area of a first surface of the base. The first bonding pads are disposed on a peripheral region of the first surface. Each of the first wirings is disposed on a corresponding first bonding pad, a first sidewall of the base, and a corresponding second bonding pad. The first testing element is disposed on the active area of the first surface and has a first testing line. The first testing line is electrically connected to at least one of the first bonding pads, and an end of the first testing line is substantially aligned with an edge of the base.
公开/授权文献
- US20210359180A1 PIXEL ARRAY SUBSTRATE 公开/授权日:2021-11-18
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