Invention Grant
- Patent Title: Fingerprint identification substrate and manufacturing method therefor, identification method and display apparatus
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Application No.: US17359507Application Date: 2021-06-26
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Publication No.: US11538848B2Publication Date: 2022-12-27
- Inventor: Yue Geng , Cheng Li , Zhonghuan Li , Kuiyuan Wang , Yi Dai , Zefei Li , Chaoyang Qi , Yajie Feng , Xiaoguan Li
- Applicant: Beijing BOE Sensor Technology Co., Ltd. , BOE Technology Group Co., Ltd.
- Applicant Address: CN Beijing; CN Beijing
- Assignee: Beijing BOE Sensor Technology Co., Ltd.,BOE Technology Group Co., Ltd.
- Current Assignee: Beijing BOE Sensor Technology Co., Ltd.,BOE Technology Group Co., Ltd.
- Current Assignee Address: CN Beijing; CN Beijing
- Agency: Ling and Yang Intellectual Property
- Agent Ling Wu; Stephen Yang
- Priority: CN202011345552.8 20201125
- Main IPC: H01L27/146
- IPC: H01L27/146 ; G06V40/13 ; G06V40/12 ; G06V10/147 ; H01L27/30

Abstract:
Provided a fingerprint identification substrate and a manufacturing method therefor, a identification method, and a display apparatus. The fingerprint identification substrate includes a substrate and at least two kinds of identification pixels disposed on the substrate, a first identification pixel includes a first photodiode and a second identification pixel includes a second photodiode. The first photodiode includes a first electrode, a first photoelectric conversion layer and a second electrode, the second photodiode includes the first electrode, a second photoelectric conversion layer and the second electrode, and the first photoelectric conversion layer and the second photoelectric conversion layer have different spectral response characteristics to red light or infrared light.
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