发明授权
- 专利标题： Integrated circuit package with partitioning based on environmental sensitivity
-
申请号： US15946868申请日： 2018-04-06
-
公开(公告)号： US11538767B2公开(公告)日： 2022-12-27
- 发明人: Barry Jon Male , Paul Merle Emerson , Kurt Peter Wachtler
- 申请人： TEXAS INSTRUMENTS INCORPORATED
- 申请人地址： US TX Dallas
- 专利权人： TEXAS INSTRUMENTS INCORPORATED
- 当前专利权人： TEXAS INSTRUMENTS INCORPORATED
- 当前专利权人地址： US TX Dallas
- 代理商 Dawn Jos; Frank D. Cimino
- 主分类号： H01L23/31
- IPC分类号： H01L23/31 ; H01L23/00 ; H01L23/34 ; H01L23/495 ; H01L23/29 ; H01L23/057
摘要：
An integrated circuit includes a lead frame, a first die, and a second die. The first die is bonded to and electrically connected to the lead frame. The second die is electrically connected to and spaced apart from the first die.
公开/授权文献
信息查询
IPC分类:
