- 专利标题: Chip-on-film structure, displaying base plate and displaying device
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申请号: US17223165申请日: 2021-04-06
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公开(公告)号: US11469211B2公开(公告)日: 2022-10-11
- 发明人: Shuang Zhang , Weihong Wu , Feifan Li , Ajuan Du , Xiaoxia Huang , Liang Gao , Hufei Yang , Enjian Yang , Hao Sun , Bin Wang , Dong Wang
- 申请人: Chengdu BOE Optoelectronics Technology Co., Ltd. , BOE Technology Group Co., Ltd.
- 申请人地址: CN Sichuan; CN Beijing
- 专利权人: Chengdu BOE Optoelectronics Technology Co., Ltd.,BOE Technology Group Co., Ltd.
- 当前专利权人: Chengdu BOE Optoelectronics Technology Co., Ltd.,BOE Technology Group Co., Ltd.
- 当前专利权人地址: CN Sichuan; CN Beijing
- 代理机构: WHDA, LLP
- 优先权: CN202011011674.3 20200923
- 主分类号: H01L23/498
- IPC分类号: H01L23/498 ; H01L25/065
摘要:
A Chip-On-Film structure, a displaying base plate and a displaying device, wherein the Chip-On-Film structure includes a first substrate; a plurality of driving chips provided on one side of the first substrate, and a plurality of first leads that are connected to the plurality of driving chips; and the plurality of first leads are for binding a displaying base plate, and a quantity of the first leads is greater than or equal to a sum of quantities of channels of the plurality of driving chips.
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