- 专利标题: Automated fiber bundle placement apparatus
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申请号: US17357263申请日: 2021-06-24
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公开(公告)号: US11458695B2公开(公告)日: 2022-10-04
- 发明人: Takeshi Ataka , Shota Tonoki
- 申请人: TSUDAKOMA KOGYO KABUSHIKI KAISHA
- 申请人地址: JP Ishikawa-ken
- 专利权人: TSUDAKOMA KOGYO KABUSHIKI KAISHA
- 当前专利权人: TSUDAKOMA KOGYO KABUSHIKI KAISHA
- 当前专利权人地址: JP Ishikawa-ken
- 代理机构: Paratus Law Group, PLLC
- 优先权: JPJP2020-125326 20200722
- 主分类号: B29C70/38
- IPC分类号: B29C70/38 ; B29C70/54
摘要:
An automated fiber bundle placement apparatus including a placing head configured to place each of fiber bundles onto a placement die and including a plurality of conveying mechanisms each configured to convey the fiber bundle toward a pressing part configured to press the fiber bundles onto the placement die, a plurality of guidance mechanisms each including a guide roller for guiding the fiber bundle toward the conveying mechanism, and a frame attached to a multi-jointed robot configured to move the placing head and provided with the conveying mechanisms and the guidance mechanisms. The frame is constituted by a main frame part provided with the conveying mechanisms and attached to the multi-jointed robot and a sub-frame part provided with the guidance mechanisms and detachably attached to the main frame part.
公开/授权文献
- US20220024157A1 AUTOMATED FIBER BUNDLE PLACEMENT APPARATUS 公开/授权日:2022-01-27
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