- 专利标题: Mold assembly for injection molding
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申请号: US16073055申请日: 2017-01-19
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公开(公告)号: US11426907B2公开(公告)日: 2022-08-30
- 发明人: Joonsang Yang , Kyungdo Kim , Seokjae Jeong , Youngkyu Kim
- 申请人: LG Electronics Inc.
- 申请人地址: KR Seoul
- 专利权人: LG Electronics Inc.
- 当前专利权人: LG Electronics Inc.
- 当前专利权人地址: KR Seoul
- 代理机构: Fish & Richardson P.C.
- 优先权: KR10-2016-0009664 20160126
- 国际申请: PCT/KR2017/000654 WO 20170119
- 国际公布: WO2017/131386 WO 20170803
- 主分类号: B29C45/00
- IPC分类号: B29C45/00 ; B29C45/27 ; B29C45/26 ; B29C45/76 ; B29K505/00
摘要:
Disclosed is a mold assembly comprising: a cavity forming an inner space to be filled with resin containing metallic particles, and having a protruding part corresponding to a hole of a molded object; a first gate disposed at any one side of the cavity so as to inject the resin into the inner space; and a second gate disposed at another side of the cavity, and injecting the resin, which flows in a second direction intersecting with a first direction, into the inner space so as to change the arrangement of the metallic particles such that a weld line, formed according to the orientation of metallic particle in the first direction, is blurred in an area at which the flow of the resin is separated by the protruding part and then comes back together.
公开/授权文献
- US20190030770A1 MOLD ASSEMBLY FOR INJECTION MOLDING 公开/授权日:2019-01-31
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