- 专利标题: Circuit module and manufacturing method for circuit module
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申请号: US16537700申请日: 2019-08-12
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公开(公告)号: US11419211B2公开(公告)日: 2022-08-16
- 发明人: Kazushige Sato , Jun Kashirajima , Yuya Eshita , Nobumitsu Amachi
- 申请人: Murata Manufacturing Co., Ltd.
- 申请人地址: JP Kyoto
- 专利权人: Murata Manufacturing Co., Ltd.
- 当前专利权人: Murata Manufacturing Co., Ltd.
- 当前专利权人地址: JP Kyoto
- 代理机构: Pearne & Gordon LLP
- 优先权: JPJP2017-028308 20170217
- 主分类号: H05K1/11
- IPC分类号: H05K1/11 ; H05K1/09 ; H05K1/18 ; H05K3/30 ; H05K3/40 ; H05K3/46
摘要:
A circuit module (100) includes a substrate (1), on one principal surface of which a first wiring pattern (2) is provided, first electronic components (3-6) constituting a first electronic circuit together with the first wiring pattern (2), a plurality of connection conductors (8), a plurality of external connection terminals, a first resin layer (9), and a second resin layer (12). At least one of the plurality of connection conductors (8) includes a first columnar conductor (8a) extending in a normal line direction of the one principal surface of the substrate (1), and a plate-like conductor (8b) extending in a direction parallel to the one principal surface of the substrate (1). At least one of the plurality of external connection terminals is a second columnar conductor (11) extending in the normal line direction of the one principal surface of the substrate (1).
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