- 专利标题： MEMS device with enhanced membrane structure and method of forming the same
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申请号： US16904560申请日： 2020-06-18
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公开(公告)号： US11418887B2公开(公告)日： 2022-08-16
- 发明人: Chun-Wen Cheng , Chun Yin Tsai , Chia-Hua Chu
- 申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- 申请人地址： TW Hsinchu
- 专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- 当前专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- 当前专利权人地址： TW Hsinchu
- 代理机构： WPAT, P.C., Intellectual Property Attorneys
- 代理商 Anthony King
- 主分类号： H04R17/02
- IPC分类号： H04R17/02 ; B81B3/00 ; B81C1/00
摘要：
A MEMS device and a method of manufacturing the same are provided. A semiconductor device includes a substrate and a membrane over the substrate. The membrane includes a piezoelectric material configured to generate charges in response to an acoustic wave. The membrane includes a via pattern having first lines that partition the membrane into slices such that the slices are separated from each other at a first region near an edge of the membrane and connected to each other at a second region.
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