A semiconductor package is provided and includes: an insulative layer having opposing first and second surfaces; a wiring layer embedded in the insulative layer and having a first side that is exposed from the first surface of the insulative layer and a second side opposing the first side and attached to the second surface of the insulative layer; at least one electronic component mounted on the second side of the wiring layer and electrically connected to the wiring layer; and an encapsulating layer formed on the second side of the wiring layer and the second surface of the insulative layer and encapsulating the electronic component. Therefore, the single wiring layer is allowed to be connected to the electronic component on one side and connected to solder balls on the other side thereof to shorten the signal transmission path.