- 专利标题： Method and apparatus for transferring micro device, and electronic product using the same
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申请号： US17045541申请日： 2019-04-16
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公开(公告)号： US11417546B2公开(公告)日： 2022-08-16
- 发明人: Byung-Ik Choi , Yun Hwangbo , Jae-Hyun Kim , Sung Uk Yoon , Chang Hyun Kim , Jung Yup Kim , Kyung-Sik Kim , Sang Min Kim , Bongkyun Jang , Kwangseop Kim
- 申请人： KOREA INSTITUTE OF MACHINERY & MATERIALS
- 申请人地址： KR Daejeon
- 专利权人： KOREA INSTITUTE OF MACHINERY & MATERIALS
- 当前专利权人： KOREA INSTITUTE OF MACHINERY & MATERIALS
- 当前专利权人地址： KR Daejeon
- 代理机构： Lex IP Meister, PLLC
- 优先权： KR10-2018-0044104 20180416
- 国际申请： PCT/KR2019/004568 WO 20190416
- 国际公布： WO2019/203531 WO 20191024
- 主分类号： H01L21/67
- IPC分类号： H01L21/67 ; B32B38/10 ; H01L25/075
摘要：
An exemplary embodiment of the present invention provides a method of transferring a micro device. The method of transferring the micro device includes: separating a transferring film from a micro device transferred to a target substrate and bending the transferring film upwardly to form a bent circular arc, and pressurizing an upper transferring film fed after the bent circular arc is formed by a pressurizing roller rotating at an upper side of the target substrate.
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