- 专利标题: Component mounting machine, component suctioning method, nozzle disposing method and method for disposing component supplying device
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申请号: US16476885申请日: 2017-01-30
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公开(公告)号: US11388849B2公开(公告)日: 2022-07-12
- 发明人: Hidetoshi Kawai , Jun Iisaka , Hidetoshi Ito
- 申请人: FUJI CORPORATION
- 申请人地址: JP Chiryu
- 专利权人: FUJI CORPORATION
- 当前专利权人: FUJI CORPORATION
- 当前专利权人地址: JP Chiryu
- 代理机构: Oblon, McClelland, Maier & Neustadt, L.L.P.
- 国际申请: PCT/JP2017/003173 WO 20170130
- 国际公布: WO2018/138911 WO 20180802
- 主分类号: H05K13/04
- IPC分类号: H05K13/04 ; H05K13/08
摘要:
A component mounting machine includes multiple component supplying devices, a head, a head moving device, and a nozzle lifting and lowering device. The component supplying device feeds out a component to a component supply position. The head includes multiple nozzles configured to suction a component. The head moving device moves the head to cause the nozzles to face the respective component supply positions with two or more thereof. The nozzle lifting and lowering device lifts and lowers the nozzle located to face the component supply positions. In positioning the nozzles to face the respective component supply positions, the head is moved so as to prioritize a positional correction of a nozzle facing a smallest sized component over positional corrections of the other nozzles, and in this state, the nozzles facing the respective component supply positions are lifted and lowered simultaneously to suction corresponding components.
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