Invention Grant
- Patent Title: Disposable insole pads and use thereof
-
Application No.: US16520460Application Date: 2019-07-24
-
Publication No.: US11375771B2Publication Date: 2022-07-05
- Inventor: Sun Hee Lehmann , Yuhong Hu , Cynthia Cain , Michael Harwell , Joanne Georgiana
- Applicant: HENKEL IP & HOLDING GMBH
- Applicant Address: DE Duesseldorf
- Assignee: HENKEL IP & HOLDING GMBH
- Current Assignee: HENKEL IP & HOLDING GMBH
- Current Assignee Address: DE Duesseldorf
- Agent Sun Hee Lehmann; Steven C. Bauman
- Main IPC: A43B17/00
- IPC: A43B17/00 ; A43B17/10 ; A43B17/14 ; B32B7/06 ; B32B7/12

Abstract:
Disposable insole pads and use thereof are disclosed. The disposable insole pads are multilayer structures comprising a topsheet and a pressure sensitive adhesive, and optionally a backsheet, silicone coating and liner layers. The pressure sensitive adhesive layer allows the disposable insole pads to be positioned, repositioned and removed, making them well suited for daily use and disposal.
Information query