- 专利标题: Front-end modules with ground plane slots
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申请号: US16978723申请日: 2018-06-07
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公开(公告)号: US11367957B2公开(公告)日: 2022-06-21
- 发明人: Chin-Hung Ma , Chien-Pai Lai , Chih Hung Chien
- 申请人: Hewlett-Packard Development Company, L.P.
- 申请人地址: US TX Spring
- 专利权人: Hewlett-Packard Development Company, L.P.
- 当前专利权人: Hewlett-Packard Development Company, L.P.
- 当前专利权人地址: US TX Spring
- 代理机构: HPI Patent Department
- 国际申请: PCT/US2018/036370 WO 20180607
- 国际公布: WO2019/236085 WO 20191212
- 主分类号: H01Q21/00
- IPC分类号: H01Q21/00 ; H01Q5/40 ; H01Q1/22 ; H01Q1/24 ; H01Q1/48 ; H01Q13/10 ; H01Q21/06
摘要:
An example radio frequency (RF) front-end module may include a printed circuit board (PCB) including a ground plane, an RF integrated circuit (RFIC) including RF components mounted on the PCB, and an antenna array on the PCB. The antenna array may operate at a first resonant frequency in a wireless communication network. Further, the RF front-end module may include a slot defined in the ground plane to provide a second resonant frequency in the wireless communication network. The second resonant frequency is lower than the first resonant frequency.
公开/授权文献
- US20210194128A1 FRONT-END MODULES WITH GROUND PLANE SLOTS 公开/授权日:2021-06-24
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