- 专利标题： Curved fluid ejection devices
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申请号： US17276971申请日： 2018-11-21
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公开(公告)号： US11351787B2公开(公告)日： 2022-06-07
- 发明人: Chien-Hua Chen , Michael W. Cumbie , Si-Iam J. Choy
- 申请人： Hewlett-Packard Development Company, L.P.
- 申请人地址： US TX Spring
- 专利权人： Hewlett-Packard Development Company, L.P.
- 当前专利权人： Hewlett-Packard Development Company, L.P.
- 当前专利权人地址： US TX Spring
- 代理机构： Fabian VanCott
- 国际申请： PCT/US2018/062302 WO 20181121
- 国际公布： WO2020/106295 WO 20200528
- 主分类号： B41J2/16
- IPC分类号： B41J2/16 ; B41J2/14 ; B29C53/04 ; B29C35/02 ; B29L31/00
摘要：
A curved fluid ejection device may include a plurality of fluid ejection dies overmolded with at least one layer of epoxy mold compound (EMC). Each of the fluid ejection dies and the EMC include a coefficient of thermal expansion (CTE). The combination of the CTE of the fluid ejection dies and the CTE of the at least one layer of EMC defines a curve within the curved fluid ejection device.
公开/授权文献
- US20220032626A1 CURVED FLUID EJECTION DEVICES 公开/授权日：2022-02-03
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