- 专利标题： Semiconductor structure
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申请号： US17031891申请日： 2020-09-24
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公开(公告)号： US11348879B2公开(公告)日： 2022-05-31
- 发明人: Rung-De Wang , Chen-Hsun Liu , Chin-Yu Ku , Te-Hsun Pang , Chia-Hua Wang , Pei-Shing Tsai , Po-Chang Lin
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址： TW Hsinchu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsinchu
- 代理机构： JCIPRNET
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L23/48 ; H01L23/522 ; H01L21/768 ; H01L23/31 ; H01L21/683 ; H01L23/58 ; H01L21/78 ; H01L21/782 ; H01L21/784 ; H01L21/8238 ; H01L23/498 ; H01L23/538
摘要：
A semiconductor structure includes a semiconductor device, a plurality of through semiconductor vias (TSV), a first seal ring, and a second seal ring. The TSVs penetrate through the semiconductor device. The TSVs are adjacent to an edge of the semiconductor device. The first seal ring is disposed on and physically connected to one end of each of the TSVs. The second seal ring is disposed on and physically connected to another end of each of the TSVs.
公开/授权文献
- US20210013159A1 SEMICONDUCTOR STRUCTURE 公开/授权日：2021-01-14
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