- 专利标题: Semiconductor wafer including silicon carbide wafer and method for manufacturing silicon carbide semiconductor device
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申请号: US17151821申请日: 2021-01-19
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公开(公告)号: US11348844B2公开(公告)日: 2022-05-31
- 发明人: Shinya Takei , Shuhei Mitani , Haruhito Ichikawa , Ippei Takahashi , Yukihiro Wakasugi
- 申请人: DENSO CORPORATION
- 申请人地址: JP Kariya
- 专利权人: DENSO CORPORATION
- 当前专利权人: DENSO CORPORATION
- 当前专利权人地址: JP Kariya
- 代理机构: Posz Law Group, PLC
- 优先权: JPJP2018-136668 20180720
- 主分类号: H01L21/02
- IPC分类号: H01L21/02 ; H01L21/66 ; H01L21/027 ; H01L21/04 ; H01L29/66
摘要:
A semiconductor wafer includes a silicon carbide wafer and an epitaxial layer, which is disposed at a surface of the silicon carbide wafer and made of silicon carbide. The semiconductor wafer satisfies a condition that a waviness value is equal to or smaller than 1 micrometer. The waviness value is a sum of an absolute value of a value α and an absolute value of a value β. A highest height among respective heights of a plurality of points with reference to a surface reference plane within a light exposure area is denoted as the value α. A lowest height among the respective heights of the points at the epitaxial layer with reference to the surface reference plane within the light exposure area is denoted as the value β.
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