- 专利标题: Coil component and method of manufacturing the same
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申请号: US16281801申请日: 2019-02-21
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公开(公告)号: US11348722B2公开(公告)日: 2022-05-31
- 发明人: Jae Hun Kim , Jin Uk Lee
- 申请人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 申请人地址: KR Suwon-si
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址: KR Suwon-si
- 代理机构: Morgan, Lewis & Bockius LLP
- 优先权: KR10-2018-0113925 20180921
- 主分类号: H01F5/00
- IPC分类号: H01F5/00 ; H01F27/29 ; H01F27/28 ; H01F41/04 ; H01F41/12 ; H01F27/32
摘要:
A coil component includes a body; an internal insulating layer buried in the body; insulating walls disposed on the internal insulating layer, and including openings each having a planar coil shape having at least one turn; coil patterns including first conductive layers disposed in the openings, and second conductive layers disposed between the first conductive layers and internal surfaces of the openings, and each having a first surface in contact with the internal insulating layer and a second surface opposing the first surface; and a recessed portion formed on the second surface of each of the coil patterns and exposing at least portions of the openings of the internal walls.
公开/授权文献
- US20200098509A1 COIL COMPONENT AND METHOD OF MANUFACTURING THE SAME 公开/授权日:2020-03-26
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