- 专利标题: Board-to-board connector
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申请号: US17184845申请日: 2021-02-25
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公开(公告)号: US11336042B2公开(公告)日: 2022-05-17
- 发明人: Junji Oosaka , Yuichi Takenaga , Akihiro Matsunaga
- 申请人: Japan Aviation Electronics Industry, Ltd.
- 申请人地址: JP Tokyo
- 专利权人: Japan Aviation Electronics Industry, Ltd.
- 当前专利权人: Japan Aviation Electronics Industry, Ltd.
- 当前专利权人地址: JP Tokyo
- 代理机构: Renner, Otto, Boisselle & Sklar, LLP
- 优先权: JPJP2020-058409 20200327
- 主分类号: H01R12/71
- IPC分类号: H01R12/71 ; H01R12/70 ; H01R12/57 ; H01R13/24 ; H01R13/502 ; H05K1/18
摘要:
A connector includes a flat-plate housing made of insulating resin and including a first positioning hole and a second positioning hole, a plurality of contacts held on the housing, and a first hold-down and a second hold-down made of metal and disposed to correspond to a first positioning hole and a second positioning hole, respectively. The housing includes a CPU board opposed surface to be opposed to a CPU board. The first hold-down includes a reinforcing plate part to cover the CPU board opposed surface around the corresponding first positioning hole. The second hold-down includes a reinforcing plate part to cover the CPU board opposed surface around the corresponding second positioning hole.
公开/授权文献
- US20210305734A1 BOARD-TO-BOARD CONNECTOR 公开/授权日:2021-09-30
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