Invention Grant
- Patent Title: Aluminum compound and method for manufacturing semiconductor device using the same
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Application No.: US16564125Application Date: 2019-09-09
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Publication No.: US11332486B2Publication Date: 2022-05-17
- Inventor: Gyu-Hee Park , Takanori Koide , Yoshiki Manabe , Masayuki Kimura , Akio Saito , Jaesoon Lim , Younjoung Cho
- Applicant: SAMSUNG ELECTRONICS CO., LTD. , ADEKA CORPORATION
- Applicant Address: KR Suwon-si; JP Tokyo
- Assignee: SAMSUNG ELECTRONICS CO., LTD.,ADEKA CORPORATION
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.,ADEKA CORPORATION
- Current Assignee Address: KR Suwon-si; JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2018-0169699 20181226
- Main IPC: C07F5/06
- IPC: C07F5/06 ; C09D1/00 ; C09D5/00 ; C23C16/20 ; H01L21/02
Abstract:
Provided are an aluminum compound and a method for manufacturing a semiconductor device using the same. The aluminum compound may be represented by Formula 1.
Public/Granted literature
- US20200207790A1 ALUMINUM COMPOUND AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME Public/Granted day:2020-07-02
Information query
