• 专利标题: Gel polish curing assembly
  • 申请号: US16916999
    申请日: 2020-06-30
  • 公开(公告)号: US11330886B2
    公开(公告)日: 2022-05-17
  • 发明人: Hung Ly
  • 申请人: Hung Ly
  • 申请人地址: US AL Montgomery
  • 专利权人: Hung Ly
  • 当前专利权人: Hung Ly
  • 当前专利权人地址: US AL Montgomery
  • 主分类号: A45D29/18
  • IPC分类号: A45D29/18 F26B9/00 A45D29/22
Gel polish curing assembly
摘要:
A gel polish curing assembly includes a housing that has a top wall, a bottom wall and a perimeter wall extending between the top and bottom walls. The perimeter wall includes a back wall, a first lateral wall and a second lateral wall. A front side of the housing is open. A plurality of light emitters is mounted within the housing. At least some of the light emitters are positioned on a bottom side of the top wall and are directed downwardly toward the bottom wall. The light emitters emits light having a wavelength that is between 340 and 380 nanometers.
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