- 专利标题: Electric wire connection structure and connection method
-
申请号: US17171855申请日: 2021-02-09
-
公开(公告)号: US11289826B2公开(公告)日: 2022-03-29
- 发明人: Hideki Adachi
- 申请人: YAZAKI CORPORATION
- 申请人地址: JP Tokyo
- 专利权人: YAZAKI CORPORATION
- 当前专利权人: YAZAKI CORPORATION
- 当前专利权人地址: JP Tokyo
- 代理机构: Kenealy Vaidya LLP
- 优先权: JPJP2020-020624 20200210
- 主分类号: H05K1/00
- IPC分类号: H05K1/00 ; H01R4/18 ; H01R4/02 ; H01R11/11 ; H01R25/16
摘要:
A connection structure for an electric wire includes an electric wire that has a conductor and an outer sheath covering the conductor; a bonding member that is made of a conductive metal material and is attached to the electric wire and; and a busbar that is made of a conductive metal material and on which the bonding member is overlapped and ultrasonically bonded with the conductor interposed between the busbar and the bonding member. The bonding member includes a crimping portion for crimping and fixing the electric wire.
公开/授权文献
- US20210249796A1 ELECTRIC WIRE CONNECTION STRUCTURE AND CONNECTION METHOD 公开/授权日:2021-08-12
信息查询