- 专利标题： Packaging methods for semiconductor devices, packaged semiconductor devices, and design methods thereof
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申请号： US16568888申请日： 2019-09-12
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公开(公告)号： US11289449B2公开(公告)日： 2022-03-29
- 发明人: Chuei-Tang Wang , Monsen Liu , Chen-Hua Yu
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址： TW Hsinchu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsinchu
- 代理机构： Slater Matsil, LLP
- 主分类号： H01L25/065
- IPC分类号： H01L25/065 ; H01L23/00 ; G06F30/394 ; H01L25/00 ; H01L21/56 ; H01L23/538 ; H01L23/498
摘要：
Packaging methods for semiconductor devices, packaged semiconductor devices, and design methods thereof are disclosed. In some embodiments, a method of packaging a plurality of semiconductor devices includes providing a first die, and coupling second dies to the first die. An electrical connection is formed between the first die and each of the second dies. A portion of each of the electrical connections is disposed between the second dies.
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