- 专利标题： Semiconductor package and manufacturing method thereof
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申请号： US16504328申请日： 2019-07-07
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公开(公告)号： US11289373B2公开(公告)日： 2022-03-29
- 发明人: Po-Yuan Teng , Bor-Rung Su , De-Yuan Lu , Hao-Yi Tsai , Tin-Hao Kuo , Tzung-Hui Lee , Tai-Min Chang
- 申请人： Taiwan Semiconductor Manufacturing Co., Ltd.
- 申请人地址： TW Hsinchu
- 专利权人： Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人地址： TW Hsinchu
- 代理机构： JCIPRNET
- 主分类号： H01L21/768
- IPC分类号： H01L21/768 ; H01L23/48 ; H01L23/31 ; H01L23/00 ; H01L21/027 ; H01L21/56
摘要：
A method includes the following steps. A seed layer is formed over a structure having at least one semiconductor die. A first patterned photoresist layer is formed over the seed layer, wherein the first patterned photoresist layer includes a first opening exposing a portion of the seed layer. A metallic wiring is formed in the first opening and on the exposed portion of the seed layer. A second patterned photoresist layer is formed on the first patterned photoresist layer and covers the metallic wiring, wherein the second patterned photoresist layer includes a second opening exposing a portion of the metallic wiring. A conductive via is formed in the second opening and on the exposed portion of the metallic wiring. The first patterned photoresist layer and the second patterned photoresist layer are removed. The metallic wiring and the conductive via are laterally wrapped around with an encapsulant.
公开/授权文献
- US20200043782A1 SEMICONDCUTOR PACKAGE AND MANUFACTURING METHOD THEREOF 公开/授权日：2020-02-06
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