- 专利标题： Flex on board anisotropic conductive adhesive interconnection
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申请号： US16770483申请日： 2017-12-22
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公开(公告)号： US11259414B2公开(公告)日： 2022-02-22
- 发明人: David Powney , Ilkka Saarinen , Mikko Kylkilahti , Lei Han
- 申请人： HUAWEI TECHNOLOGIES CO., LTD.
- 申请人地址： CN Shenzhen
- 专利权人： HUAWEI TECHNOLOGIES CO., LTD.
- 当前专利权人： HUAWEI TECHNOLOGIES CO., LTD.
- 当前专利权人地址： CN Shenzhen
- 代理机构： Hauptman Ham, LLP
- 国际申请： PCT/EP2017/084519 WO 20171222
- 国际公布： WO2019/120583 WO 20190627
- 主分类号： H05K1/00
- IPC分类号： H05K1/00 ; H05K3/32 ; H05K1/18 ; H05K3/36
摘要：
An apparatus includes a printed circuit board and a flexible printed circuit. A rigid structure component is on a first side of the printed circuit board. An interconnection interface is on a second side of the printed circuit board opposite to the rigid structure component and is configured to interconnect the flexible printed circuit and the printed circuit board. A conductive interconnection material is at the interconnection interface between the flexible printed circuit and the printed circuit board.
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