- 专利标题: Stack structure of printed circuit boards using interposer and electronic device including the same
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申请号: US16789575申请日: 2020-02-13
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公开(公告)号: US11245207B2公开(公告)日: 2022-02-08
- 发明人: Jungsik Park , Inkuk Yun , Sunghyup Lee , Heeseok Jung , Woongeun Kwak
- 申请人: Samsung Electronics Co., Ltd.
- 申请人地址: KR Gyeonggi-do
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Gyeonggi-do
- 代理机构: Cha & Reiter, LLC
- 优先权: KR10-2019-0019131 20190219
- 主分类号: H05K5/00
- IPC分类号: H05K5/00 ; H01R12/52 ; H05K1/11
摘要:
An electronic device is disclosed, including: a first support member including at least one screw-fastening portion; a first printed circuit board (PCB) stacked on the first support member and including at least one screw-fixing portion facing the at least one screw-fastening portion; a second PCB spaced apart from the first PCB, including a first screw guide groove; an interposer disposed between the first PCB and the second PCB electrically connecting them and including a second screw guide groove facing the first screw guide groove; and a second support member stacked on the second PCB and including a screw inlet portion facing the first screw guide groove. The second support member, the first PCB, and the first support member are fixed to each other via a screw inserted through the screw inlet portion.
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