- 专利标题: Method of manufacturing light-emitting module
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申请号: US17020838申请日: 2020-09-15
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公开(公告)号: US11244935B2公开(公告)日: 2022-02-08
- 发明人: Takashi Ishii , Dai Wakamatsu , Hiroaki Kageyama
- 申请人: NICHIA CORPORATION
- 申请人地址: JP Anan
- 专利权人: NICHIA CORPORATION
- 当前专利权人: NICHIA CORPORATION
- 当前专利权人地址: JP Anan
- 代理机构: Mori & Ward, LLP
- 优先权: JPJP2019-169177 20190918
- 主分类号: H01L21/00
- IPC分类号: H01L21/00 ; H01L25/075 ; H01L33/00
摘要:
A method of manufacturing a light-emitting module that includes providing a light-transmissive member joined body that includes a plurality of submounts, a plurality of light-emitting elements each of which is disposed on a respective one of submounts, and a single light-transmissive member disposed on the light-emitting elements. The method further includes disposing the light-transmissive member joined body on a module board such that the submounts face the module board, forming a plurality of element structures by dividing the single light-transmissive member for each light-emitting element into the element structures each of which includes the submount, the light-emitting element, and the light-transmissive member positioned in this order, and forming a first covering member on the module board to cover lateral surfaces of the element structures.
公开/授权文献
- US20210082885A1 METHOD OF MANUFACTURING LIGHT-EMITTING MODULE 公开/授权日:2021-03-18
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