A damping mechanism is provided, including a damper housing, a damping assembly provided within the damper housing, and a damper cover assembly fitted to at least a portion of the damper housing. The damper cover assembly includes a damper cover and at least one connection member attached thereto. A recess is provided on a rearward side of the damper cover, and at least one receptacle is provided, defining an opening on a bottom surface of the damper cover and being adapted to receive and retain therein at least a portion of the at least one connection member of the damper cover assembly. The recess of the damper cover and the connection member of the damper cover assembly are cooperatively adapted to provide a mechanical connection between the damping mechanism and a hinge cup of a hinge assembly in a removable manner.