- 专利标题： Alignment device, semiconductor wafer processing device, and alignment method
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申请号： US16236766申请日： 2018-12-31
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公开(公告)号： US11232962B2公开(公告)日： 2022-01-25
- 发明人: Hiroki Watanabe , Tetsuya Sakai , Hiroshi Kikai
- 申请人： HIRATA CORPORATION
- 申请人地址： JP Kumamoto
- 专利权人： HIRATA CORPORATION
- 当前专利权人： HIRATA CORPORATION
- 当前专利权人地址： JP Kumamoto
- 代理机构： Paratus Law Group, PLLC
- 优先权： JPJP2018-122933 20180628
- 主分类号： H01L21/67
- IPC分类号： H01L21/67 ; H01L21/68 ; H01L21/687
摘要：
An alignment device which aligns notch portions of wafers includes mounting tables that hold the wafers, movement units that move the mounting tables, notch portion detection units that detect a circumferential positions of the notch portion, and a controller that controls positions of the mounting tables by the movement units. The mounting tables includes a mounting table main body portion and a pad member attached to an opening in the mounting table main body portion to hold the wafers. The pad member includes the main body portion that is attached to the opening and has a through hole in a center portion thereof, the first annular portion on an end side of the pad member to abut against wafers, and the first collar portion that is integrally provided with the first annular portion and the main body portion and extends toward outside of the main body portion.
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