Invention Grant
- Patent Title: Heat sinking layer between a substrate and encasing layers of a recording head
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Application No.: US17116107Application Date: 2020-12-09
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Publication No.: US11217273B1Publication Date: 2022-01-04
- Inventor: Helene Parwana Habibi , Vasudevan Ramaswamy , Raul H. Andruet , Neil Zuckerman , Frank A. McGinnity , Giovanni A. Badini Confalioneri , Martin L. McGarry , James G. Wessel , Pablo G. Levi
- Applicant: Seagate Technology LLC
- Applicant Address: US CA Fremont
- Assignee: Seagate Technology LLC
- Current Assignee: Seagate Technology LLC
- Current Assignee Address: US CA Fremont
- Agency: Westman, Champlin & Koehler, P.A.
- Main IPC: G11B11/105
- IPC: G11B11/105 ; G11B5/31 ; G11B5/00 ; G11B5/60 ; G11B5/48
Abstract:
A recording head includes one or more transducer elements, and an electrically insulative layer encasing the one or more transducer elements. The recording head also includes a substrate below the electrically insulative layer. The recording head further includes a heat sinking layer between the electrically insulative layer and the substrate.
Information query
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