Invention Grant
- Patent Title: Integrating system in package (SiP) with input/output (IO) board for platform miniaturization
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Application No.: US16546280Application Date: 2019-08-20
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Publication No.: US11114421B2Publication Date: 2021-09-07
- Inventor: Eng Huat Goh , Wee Hoe , Khang Choong Yong , Ping Ping Ooi
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Spectrum IP Law Group LLC
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/02 ; H05K1/11 ; H05K1/18 ; H05K3/30 ; H01L23/00 ; H01L23/36 ; H01L23/48 ; H01L23/64 ; H01L23/495 ; H01L23/498 ; H01L25/16 ; H01L25/18 ; H01L25/065 ; H01L23/538 ; H01L25/00 ; H05K1/14
Abstract:
Methods and apparatus relating to integrating System in Package (SiP) with Input/Output (IO) board for platform miniaturization are described. In an embodiment, a SiP board includes a plurality of logic components. An IO board is coupled to the SiP board via a grid array. The plurality of logic components is provided on both sides of the SiP board and one or more of the plurality of logic components are to positioned in an opening in the IO board. Other embodiments are also disclosed and claimed.
Information query
