- 专利标题： Electro-optical package and method of fabrication
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申请号： US16382076申请日： 2019-04-11
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公开(公告)号： US11054597B2公开(公告)日： 2021-07-06
- 发明人: Vivek Raghunathan , Vivek Raghuraman , Karlheinz Muth , David Arlo Nelson , Chia-Te Chou , Brett Sawyer , SeungJae Lee
- 申请人： ROCKLEY PHOTONICS LIMITED
- 申请人地址： GB London
- 专利权人： ROCKLEY PHOTONICS LIMITED
- 当前专利权人： ROCKLEY PHOTONICS LIMITED
- 当前专利权人地址： GB London
- 代理机构： Lewis Roca Rothgerber Christie LLP
- 主分类号： G02B6/12
- IPC分类号： G02B6/12 ; G02B6/43 ; G02B6/42 ; H01L25/16 ; H05K1/02 ; H05K3/30
摘要：
An electro-optical package. In some embodiments, the electro-optical package includes a first electro-optical chip coupled to an array of optical fibers, and a first physical medium dependent integrated circuit coupled to the first electro-optical chip.
公开/授权文献
- US10921538B2 Electro-optical package and method of fabrication 公开/授权日：2021-02-16
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