- 专利标题: Memory cooling system in a server
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申请号: US16818019申请日: 2020-03-13
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公开(公告)号: US11051421B1公开(公告)日: 2021-06-29
- 发明人: Yi-Chieh Chen , Yueh-Chang Wu , Ching-Yi Shih
- 申请人: Quanta Computer Inc.
- 申请人地址: TW Taoyuan
- 专利权人: Quanta Computer Inc.
- 当前专利权人: Quanta Computer Inc.
- 当前专利权人地址: TW Taoyuan
- 代理机构: Nixon Peabody LLP
- 主分类号: G06F1/16
- IPC分类号: G06F1/16 ; H05K5/00 ; H05K7/00 ; H05K7/14 ; H05K7/20
摘要:
A cooling assembly includes a primary plate, a secondary plate, and a padding layer. The primary plate includes a body, a first arm, and a second arm. The first arm and the second arm of the primary plate extend outwardly in opposite directions from the body of the primary plate. The secondary plate also includes a body, a first arm, and a second arm. The first arm and the second arm of the secondary plate extend outwardly in opposite directions from the body of the secondary plate. The padding layer is inserted between the primary plate and the secondary plate. The padding layer directly contacts a heat-generating electrical component secured between the primary plate and the secondary plate.
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