- 专利标题: Electronic devices having circuitry in housing attachment structures
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申请号: US16589643申请日: 2019-10-01
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公开(公告)号: US11050452B2公开(公告)日: 2021-06-29
- 发明人: James G. Horiuchi , Tyler S. Bushnell , Brad G. Boozer , Mario Martinis , YoungHoon Kim
- 申请人: Apple Inc.
- 申请人地址: US CA Cupertino
- 专利权人: Apple Inc.
- 当前专利权人: Apple Inc.
- 当前专利权人地址: US CA Cupertino
- 代理机构: Treyz Law Group, P.C.
- 代理商 G. Victor Treyz; Tianyi He
- 主分类号: H04B1/3827
- IPC分类号: H04B1/3827 ; H01Q1/24 ; G06F3/044 ; H01Q1/27
摘要:
An electronic device housing may be formed from housing members. A first housing member may form a display cover layer that overlaps pixels. During operation, the pixels may display an image that is viewable through the display cover layer. The second housing member may have a rear wall portion and a sidewall. A band may be coupled to the sidewall or other portion of the second housing member. The first and second housing members may be attached together using a housing member attachment structure. The housing member attachment structure may have layers of adhesive and printed circuit structures. The printed circuit structures may include metal traces that form an antenna and that form capacitive force sensor electrodes on opposing sides of a compressible member.
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