- 专利标题： Method of changing a switching module using pressure-applying device
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申请号： US16279451申请日： 2019-02-19
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公开(公告)号： US11026341B2公开(公告)日： 2021-06-01
- 发明人: Teagsun Jung
- 申请人： LSIS CO., LTD.
- 申请人地址： KR Anyang-si
- 专利权人： LSIS CO., LTD.
- 当前专利权人： LSIS CO., LTD.
- 当前专利权人地址： KR Anyang-si
- 代理机构： K&L Gates LLP
- 优先权： KR10-2018-0037096 20180330
- 主分类号： H05K7/12
- IPC分类号： H05K7/12 ; H01L29/74 ; H02J3/18 ; H05K7/20 ; H01L23/40 ; H01L21/50 ; H05K7/14 ; H01L25/00 ; H01L25/11
摘要：
A switching module may include a plurality of cooling plates stacked along a vertical direction, a switch disposed between the cooling plates, a first supporting member disposed below the lowermost cooling plate, a second supporting member disposed above the uppermost cooling plate, first and second pressing support portions disposed between the lowermost cooling plate and the first supporting member, and a pressing member disposed between the uppermost cooling plate and the second supporting member.
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