- 专利标题： Substrate processing apparatus and apparatus for manufacturing integrated circuit device
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申请号： US15827144申请日： 2017-11-30
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公开(公告)号： US10985036B2公开(公告)日： 2021-04-20
- 发明人: Young-Hoo Kim , Sang-Jine Park , Yong-Jhin Cho , Yeon-Jin Gil , Ji-Hoon Jeong , Byung-Kwon Cho , Yong-Sun Ko , Kun-Tack Lee
- 申请人： Samsung Electronics Co., Ltd.
- 申请人地址： KR Suwon-si
- 专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人地址： KR Suwon-si
- 代理机构： Muir Patent Law, PLLC
- 优先权： KR10-2017-0071729 20170608
- 主分类号： H01L21/67
- IPC分类号： H01L21/67 ; H01L21/687 ; H01L21/02
摘要：
A substrate processing apparatus includes a vessel providing a processing space for processing a substrate, a substrate support supporting the substrate loaded in the processing space, and a barrier between a side wall of the vessel and the substrate support and surrounding an edge of the substrate supported by the substrate support.
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